PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
CD4073BM96
CD4073BNSR
CD4073BPWR
CD4081BM96
CD4081BNSR
CD4081BPWR
CD4082BM96
CD4082BNSR
CD4082BPWR
SOIC
SO
D
14
14
14
14
14
14
14
14
14
2500
2000
2000
2500
2000
2000
2500
2000
2000
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
33.0
33.0
29.0
33.0
33.0
29.0
33.0
33.0
29.0
NS
PW
D
TSSOP
SOIC
SO
NS
PW
D
TSSOP
SOIC
SO
NS
PW
TSSOP
Pack Materials-Page 2