PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
CD4073BM96
CD4073BMT
CD4073BNSR
CD4073BPWR
CD4081BM96
CD4081BMT
CD4081BNSR
CD4081BPWR
CD4082BM96
CD4082BMT
CD4082BNSR
CD4082BPWR
SOIC
SOIC
SO
D
D
14
14
14
14
14
14
14
14
14
14
14
14
2500
250
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
38.0
38.0
38.0
35.0
38.0
38.0
38.0
35.0
38.0
38.0
38.0
35.0
NS
PW
D
2000
2000
2500
250
TSSOP
SOIC
SOIC
SO
D
NS
PW
D
2000
2000
2500
250
TSSOP
SOIC
SOIC
SO
D
NS
PW
2000
2000
TSSOP
Pack Materials-Page 2
TI [ TEXAS INSTRUMENTS ]
