PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
CD4073BM96
CD4073BMT
CD4073BNSR
CD4073BPWR
CD4081BM96
CD4081BMT
CD4081BNSR
CD4081BPWR
CD4082BM96
CD4082BMT
CD4082BNSR
CD4082BPWR
SOIC
SOIC
SO
D
D
14
14
14
14
14
14
14
14
14
14
14
14
2500
250
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
16.4
16.4
16.4
12.4
16.4
16.4
16.4
12.4
16.4
16.4
16.4
12.4
6.5
6.5
8.2
6.9
6.5
6.5
8.2
6.9
6.5
6.5
8.2
6.9
9.0
9.0
2.1
2.1
2.5
1.6
2.1
2.1
2.5
1.6
2.1
2.1
2.5
1.6
8.0
8.0
16.0
16.0
16.0
12.0
16.0
16.0
16.0
12.0
16.0
16.0
16.0
12.0
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
NS
PW
D
2000
2000
2500
250
10.5
5.6
12.0
8.0
TSSOP
SOIC
SOIC
SO
9.0
8.0
D
9.0
8.0
NS
PW
D
2000
2000
2500
250
10.5
5.6
12.0
8.0
TSSOP
SOIC
SOIC
SO
9.0
8.0
D
9.0
8.0
NS
PW
2000
2000
10.5
5.6
12.0
8.0
TSSOP
Pack Materials-Page 1