www.ti.com
SLUS618F – AUGUST 2004 – REVISED NOVEMBER 2006
ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range (unless otherwise noted)
bq24030, bq24031, bq24032A,
bq24035, bq24038
Input voltage
AC (DC voltage wrt (with respect to) VSS)
USB (DC voltage wrt VSS)
BAT, CE, DPPM, ACPG, PSEL, OUT, ISET1, ISET2, STAT1,
STAT2, TS, USBPG , PG, VBSEL (all DC voltages wrt VSS)
Input voltage
LDO (DC voltage wrt VSS)
TMR
Input current
Output current
Output source current (in
regulation at 3.3 V LDO)
Output sink current
Storage temperature range, T
stg
Junction temperature range, T
J
Lead temperature (soldering, 10 seconds)
(1)
AC
USB
OUT
BAT
(2)
LDO
ACPG, STAT1, STAT2, USBPG, PG
–0.3 V to 18 V
–0.3 V to 7 V
–0.3 V to 7 V
–0.3 V to V
O(OUT)
+ 0.3 V
–0.3 V to V
O(LDO)
+ 0.3 V
3.5 A
1000 mA
4A
–4 A to 3.5 A
30 mA
1.5 mA
–65°C to 150°C
–40°C to 150°C
300°C
(2)
Stresses beyond those listed under
absolute maximum ratings
may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under
recommended operating
conditions
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage
values are with respect to the network ground terminal unless otherwise noted.
Negative current is defined as current flowing into the BAT pin.
RECOMMENDED OPERATING CONDITIONS
MIN
V
CC
V
CC
I
AC
I
USB
T
J
(1)
(2)
Supply voltage (from AC input)
(1) (2)
MAX
16
16
6
2
0.5
UNIT
V
bq24030/31/32A/35, bq24038 (at VBSEL = LOW)
bq24038 (at VBSEL = HIGH)
(1)
4.35
4.55
4.35
Supply voltage (from USB input)
Input current, AC
Input current, USB
A
°C
Operating junction temperature range
V
CC
is defined as the greater of AC or USB input.
Verify that power dissipation and junction temperatures are within limits at maximum V
CC
.
–40
125
DISSIPATION RATINGS
PACKAGE
20-pin RHL
(1)
(1)
T
A
≤
40°C
POWER RATING
1.81 W
DERATING FACTOR
T
A
> 40°C
21 mW/°C
θ
JA
46.87 °C/W
This data is based on using the JEDEC High-K board and the exposed die pad is connected to a Cu pad on the board. This is
connected to the ground plane by a 2×3 via matrix.
3