PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
Orderable Device
TL3844BD
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
D
14
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TL3844BD-8
TL3844BDG4
TL3844BDG4-8
TL3844BDR-8
TL3844BDRG4
TL3844BDRG4-8
TL3844BP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
D
D
D
D
D
D
P
P
D
D
D
D
D
D
D
D
P
P
8
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14
8
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14
8
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8
50
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
TL3844BPE4
TL3845BD
8
50
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
14
8
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TL3845BD-8
TL3845BDG4
TL3845BDG4-8
TL3845BDR
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14
8
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14
8
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TL3845BDR-8
TL3845BDRG4
TL3845BDRG4-8
TL3845BP
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
14
8
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
8
50
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
TL3845BPE4
8
50
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
Addendum-Page 3
TI [ TEXAS INSTRUMENTS ]
