73S1121F
EMV Smart-Card Terminal Controller
with Built-in Dual ISO-7816 Interface and USB
DATA SHEET
ORDERING INFORMATION
PART DESCRIPTION
ORDER NO.
PACKAGING MARK
73S1121F – Die form
73S1121F-DIE
N/A
73S1121F - 128 pin TQFP
73S1121F-CGV
73S1121F-CGV
73S1121F-CGV
73S1121F-CGV
73S1121F-CGV
73S1121F - 128 pin TQFP Tape / Reel
73S1121F - 128 pin TQFP Lead-Free
73S1121F - 128 pin TQFP Lead-Free Tape / Reel
73S1121F-CGVR
73S1121F-CGV / F
73S1121F-CGVR / F
No responsibility is assumed by TERIDIAN Semiconductor Corporation for use of this product nor for any infringements of
patents and trademarks or other rights of third parties resulting from its use. No license is granted under any patents, patent
rights or trademarks of TERIDIAN Semiconductor Corporation. TERIDIAN semiconductor Corporation reserves the right to
make changes in specifications at any time without notice. Accordingly, the reader is cautioned to verify that the data sheet is
current before placing orders.
Data Sheet
This data sheet is proprietary to TERIDIAN Semiconductor Corporation (TSC) and sets forth design goals for the described
product. The data sheet is subject to change. TSC assumes no obligation regarding future manufacture, unless agreed to in
writing. If and when manufactured and sold, this product is sold subject to the terms and conditions of sale supplied at the
time of order acknowledgment, including those pertaining to warranty, patent infringement and limitation of liability. TERIDIAN
Semiconductor Corporation (TSC) reserves the right to make changes in specifications at any time without notice. Accordingly,
the reader is cautioned to verify that a data sheet is current before placing orders. TSC assumes no liability for applications
assistance.
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http://www.teridiansemi.com
11/2/05 Rev. 2.3
Page: 25 of 25
© 2005 TERIDIAN Semiconductor Corporation
Rev 2.3
TERIDIAN [ TERIDIAN SEMICONDUCTOR CORPORATION ]
