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73M1922-IVTR/F 参数 Datasheet PDF下载

73M1922-IVTR/F图片预览
型号: 73M1922-IVTR/F
PDF下载: 下载PDF文件 查看货源
内容描述: [Consumer Circuit, PDSO20, ROHS COMPLIANT, MO-153AC, TSSOP-20]
分类和应用: 光电二极管商用集成电路
文件页数/大小: 82 页 / 1086 K
品牌: TERIDIAN [ TERIDIAN SEMICONDUCTOR CORPORATION ]
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73M1822/73M1922 Data Sheet  
DS_1x22_001  
Pin  
Pin Name  
Number  
Type  
Description  
Crystal oscillator circuit input pin.  
14  
OSCIN/MCLK  
I
Input from an external clock source. Crystal frequency range  
supported is 9 MHz – 27 MHz.  
15  
16  
17  
18  
19  
20  
OSCOUT  
VNA/VNPLL  
VNA  
O
Crystal oscillator output pin. (N.C. with external oscillator)  
Negative PLL ground  
GND  
GND  
O
Negative analog ground  
Call progress audio output  
AOUT  
VPA/VPM  
VNM/VNT  
PWR  
GND  
Positive analog supply  
Negative transformer supply  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
41  
42  
M/S  
I
Master or slave selection / reset - active during transition  
S/Sh regulator sense  
SRE  
SRB  
VBG  
ACS  
VNS  
VPS  
RXP  
RXM  
TXM  
DCD  
DCS  
DCG  
DCI  
I
O
S/Sh regulator drive  
O
VBG bypass, connect to 0.1uF capacitor to VPS  
AC current sense  
I
GND  
LIC analog/digital negative ground  
LIC analog/digital positive supply voltage  
Receive plus -signal input  
PWR  
I
I
Receive minus - signal input  
Transmit minus - signal output  
DCD for integrated Darlington  
DC loop current sense  
O
O
I
O
DC loop drive  
I
DC loop input  
RGM  
RGP  
OFH  
M20BP  
VND/VNX  
SCP  
MID  
I
I
Ring minus voltage input  
Ring plus voltage input  
O
Off-hook control  
I
Substrate connection. Connect to VNX.  
LIC digital/analog negative ground  
Positive side of the secondary pulse transformer winding  
Charge pump -normally left open  
LIC supply from the barrier side  
GND  
I/O  
I/O  
PWR  
VPX  
2.6 Exposed Bottom Pad on 73M1x66B QFN Packages  
The 73M1822 and 73M1922 QFN packages have exposed pads on the underside that are intended  
for device manufacturing purposes. These exposed pads are not intended for thermal relief (heat  
dissipation) and should not be soldered to the PCB. Soldering of the exposed pad could also  
compromise electrical isolation/insulation requirements for proper voltage isolation. Avoid any PCB  
traces or through-hole vias on the PCB beneath the exposed pad area.  
16  
Rev. 1.6