REVISIONS
LTR
A
DESCRIPTION
Changes in accordance with NOR 5962-R227-93.
DATE (YR-MO-DA)
93-09-30
APPROVED
Michael A. Frye
B
Added packages Z and U and device types 04,05, and 06 to drawing.
Updated boilerplate. - glg
Added packages T and N. Added radiation features to appropriate
paragraphs. Updated boilerplate paragraphs. ksr
Corrected dose rate to 0.1 rads(Si)/s. Updated boilerplate
paragraphs. ksr
00-05-30
Raymond Monnin
C
01-12-18
Raymond Monnin
D
02-04-15
Raymond Monnin
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
D
15
D
16
D
17
D
18
REV
SHEET
PREPARED BY
Jeff Bowling
D
19
D
20
D
21
D
1
D
22
D
2
D
23
D
3
D
24
D
4
D
25
D
5
D
26
D
6
D
27
D
7
D
28
D
8
D
29
D
9
D
30
D
10
D
11
D
12
D
13
D
14
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
http://www.dscc.dla.mil
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS
AVAILABLE
FOR USE BY All
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
CHECKED BY
Jeff Bowling
APPROVED BY
Michael A. Frye
DRAWING APPROVAL DATE
MICROCIRCUIT, MEMORY,
DIGITAL, CMOS, 16K x 9
PARALLEL FIFO, MONOLITHIC
SILICON
SIZE
A
SHEET
CAGE CODE
93-06-09
REVISION LEVEL
D
67268
5962-93177
1 OF 30
5962-E257-02
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
TEMIC [ TEMIC SEMICONDUCTORS ]
