SILICON PIN DIODES
Low cost square ceram ic package PIN diodes
LOW COST S QUARE CERAMIC PACKAGE P IN DIODES
Features
Description
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Low loss, low distortion
TEMEX is m anufacturing a square PIN diode
for surface m ount applications. The chip inside
is passivated to ensure high reliability and very
low leakage current. These diodes ensure high
power switching at frequencies from HF to few
GHz. This package utilizes ceram ic package
technology with low inductance and leadless
faced package. The design sim plifies autom atic
pick and place indexing and assem bly.
The term ination contacts are tin plated for
vapor or reflow circuit board soldering. The
active area is a PIN glass passivated chip, which
can be designed to custom er specifications.
Low inductance
High reliability
Herm etically sealed package
Non rolling MELF design
Pick and place com patibility
Pinning
Outline draw ing
SOLDERABLE
SURFACES
CERAMIC
C
B
Millimeters
Inches
Package Symbol min. max min. max
CHIP
FULL FACE BOND
A
B
C
A
B
C
A
B
C
2
2.3
3.5
0.8
2.8
5.2
0.8
.079 .091
.114 .138
.012 .031
.098 .0110
.185 .205
.012 .031
SMD4
SMD6
SMD8
2.9
0.3
2.5
4.7
0.3
3.50 3.81 .138 .150
4.70 5.2
.185 .205
0.20 0.38 .008 .015
12-10
Vol. 1
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