欢迎访问ic37.com |
会员登录 免费注册
发布采购

MLF2012E8R2KT 参数 Datasheet PDF下载

MLF2012E8R2KT图片预览
型号: MLF2012E8R2KT
PDF下载: 下载PDF文件 查看货源
内容描述: 电感器的标准多层电路/ STD磁屏蔽MLF系列 [Inductors for Standard Circuits Multilayer/STD magnetic shielded MLF series]
分类和应用: 电感器固定电感器测试射频感应器
文件页数/大小: 10 页 / 123 K
品牌: TDK [ TDK ELECTRONICS ]
 浏览型号MLF2012E8R2KT的Datasheet PDF文件第1页浏览型号MLF2012E8R2KT的Datasheet PDF文件第3页浏览型号MLF2012E8R2KT的Datasheet PDF文件第4页浏览型号MLF2012E8R2KT的Datasheet PDF文件第5页浏览型号MLF2012E8R2KT的Datasheet PDF文件第6页浏览型号MLF2012E8R2KT的Datasheet PDF文件第7页浏览型号MLF2012E8R2KT的Datasheet PDF文件第8页浏览型号MLF2012E8R2KT的Datasheet PDF文件第9页  
(1/9)  
Conformity to RoHS Directive  
Inductors for Standard Circuits  
Multilayer/STD • Magnetic Shielded  
MLF Series MLF1005L  
Various digital devices are required to be further downsized yet  
remain highly functional, and to excel in low power consumption,  
and parts mounted on the devices are also required to have lower  
resistance.  
PRODUCT IDENTIFICATION  
MLF 1005 R10  
(1) (2) (3) (4) (5) (6)  
L
K
T
(7)  
(1) Series name  
The MLF1005L type is a new line of inductors that have been  
developed to meet such requirements: their resistance has been  
lowered by up to 35% in comparison with that of the existing  
MLF1005 type.  
(2) Dimensions L×W  
1005  
1.0×0.5×0.5  
In addition, the new inductors use similar magnetic shielding,  
which enables their high-density mounting.  
(3) Type name  
L
Low-resistance type  
FEATURES  
(4) Inductance  
• The resistance of the MLF1005L type has been lowered by up to  
35% in comparison with that of the existing MLF1005 type.  
• Magnetically shielded configuration allowing for high-density  
mounting.  
R10  
1R0  
0.1µH  
1.0µH  
(5) Tolerance  
K
• Does not contain lead and is compatible with lead-free  
soldering.  
10%  
• It is a product conforming to RoHS directive.  
(6) Packaging style  
T
Taping [reel]  
APPLICATIONS  
Signal processing modules such as cellular phones and tuners  
(7) TDK internal code  
SPECIFICATIONS  
PACKAGING STYLE AND QUANTITIES  
Operating temperature range  
Storage temperature range  
–40 to +85°C  
–40 to +85°C(After mount)  
Packaging style  
Taping  
Quantity  
10000 pieces/reel  
RECOMMENDED SOLDERING CONDITION  
REFLOW SOLDERING  
HANDLING AND PRECAUTIONS  
• Before soldering, be sure to preheat components.  
The preheating temperature should be set so that the tempera-  
ture difference between the solder temperature and product  
temperature does not exceed 150°C.  
10s max.  
250 to 260˚C  
230˚C  
Natural  
cooling  
• After mounting components onto the printed circuit board, do not  
apply stress through board bending or mishandling.  
• The inductance value may change due to magnetic saturation if  
the current exceeds the rated maximum.  
180˚C  
150˚C  
• Do not expose the inductors to stray magnetic fields.  
• Avoid static electricity discharge during handling.  
• When hand soldering, apply the soldering iron to the printed cir-  
cuit board only. Temperature of the iron tip should not exceed  
350°C. Soldering time should not exceed 3 seconds.  
Preheating  
60 to 120s  
Soldering  
30 to 60s  
Time(s)  
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific  
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.  
• Please contact our Sales office when your application is considered the following:  
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)  
• All specifications are subject to change without notice.  
001-05 / 20111129 / e511_mlf_02  
 复制成功!