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MLF2012E8R2KT 参数 Datasheet PDF下载

MLF2012E8R2KT图片预览
型号: MLF2012E8R2KT
PDF下载: 下载PDF文件 查看货源
内容描述: 电感器的标准多层电路/ STD磁屏蔽MLF系列 [Inductors for Standard Circuits Multilayer/STD magnetic shielded MLF series]
分类和应用: 电感器固定电感器测试射频感应器
文件页数/大小: 10 页 / 123 K
品牌: TDK [ TDK ELECTRONICS ]
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Inductors for Standard Circuits
Multilayer/STD • Magnetic Shielded
MLF Series MLF1005L
Various digital devices are required to be further downsized yet
remain highly functional, and to excel in low power consumption,
and parts mounted on the devices are also required to have lower
resistance.
The MLF1005L type is a new line of inductors that have been
developed to meet such requirements: their resistance has been
lowered by up to 35% in comparison with that of the existing
MLF1005 type.
In addition, the new inductors use similar magnetic shielding,
which enables their high-density mounting.
FEATURES
• The resistance of the MLF1005L type has been lowered by up to
35% in comparison with that of the existing MLF1005 type.
• Magnetically shielded configuration allowing for high-density
mounting.
• Does not contain lead and is compatible with lead-free
soldering.
• It is a product conforming to RoHS directive.
APPLICATIONS
Signal processing modules such as cellular phones and tuners
SPECIFICATIONS
Operating temperature range
Storage temperature range
–40 to +85°C
–40 to +85°C(After mount)
Conformity to RoHS Directive
PRODUCT IDENTIFICATION
MLF 1005 L R10 K T
(1)
(2) (3) (4) (5) (6)
(1) Series name
(2) Dimensions L×W
1005
1.0×0.5×0.5
(7)
(3) Type name
L
Low-resistance type
(4) Inductance
R10
1R0
0.1µH
1.0µH
(5) Tolerance
K
±10%
(6) Packaging style
T
Taping [reel]
(7) TDK internal code
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
Quantity
10000 pieces/reel
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
10s max.
250 to 260˚C
230˚C
Natural
cooling
180˚C
150˚C
Preheating
60 to 120s
Time(s)
Soldering
30 to 60s
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components.
The preheating temperature should be set so that the tempera-
ture difference between the solder temperature and product
temperature does not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• The inductance value may change due to magnetic saturation if
the current exceeds the rated maximum.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
001-05 / 20111129 / e511_mlf_02