ICS-40180
SOLDERING PROFILE
CRITICAL ZONE
TO T
tP
T
L
P
T
P
RAMP-UP
T
L
tL
T
SMAX
T
SMIN
tS
RAMP-DOWN
PREHEAT
t25°C TO PEAK TEMPERATURE
TIME
Figure 1. Recommended Soldering Profile Limits
TABLE 3. RECOMMENDED SOLDERING PROFILE*
PROFILE FEATURE
Sn63/Pb37
Pb-Free
Average Ramp Rate (TL to TP)
1.25°C/sec max
1.25°C/sec max
Minimum Temperature
100°C
150°C
100°C
(TSMIN
Minimum Temperature
(TSMIN
Time (TSMIN to TSMAX), tS
)
Preheat
200°C
)
60 sec to 75 sec
1.25°C/sec
60 sec to 75 sec
1.25°C/sec
~50 sec
Ramp-Up Rate (TSMAX to TL)
Time Maintained Above Liquidous (tL)
Liquidous Temperature (TL)
Peak Temperature (TP)
45 sec to 75 sec
183°C
217°C
215°C +3°C/−3°C
260°C +0°C/−5°C
Time Within +5°C of Actual Peak
Temperature (tP)
20 sec to 30 sec
20 sec to 30 sec
3°C/sec max
Ramp-Down Rate
3°C/sec max
5 min max
Time +25°C (t25°C) to Peak Temperature
5 min max
*The reflow profile in Table 3 is recommended for board manufacturing with InvenSense MEMS microphones. All microphones are
also compatible with the J-STD-020 profile
Page 5 of 14
Document Number: DS-000021
Revision: 1.2
TDK [ TDK ELECTRONICS ]
