ICS-40180
PCB DESIGN AND LAND PATTERN LAYOUT
Below is the lay out the PCB land pattern for the ICS-40180, at a 1:1 ratio to the solder pads on the microphone package, (see Figure
11.) Take care to avoid applying solder paste to the sound hole in the PCB. Figure 12 shows a suggested solder-paste stencil pattern
layout. The response of the ICS-40180 is not affected by the PCB hole size, as long as the hole is not smaller than the sound port of the
microphone (0.25 mm, or 0.01 inch, in diameter). A 0.5 mm to 1 mm (0.020 inch to 0.040 inch) diameter for the hole is
recommended.
Align the hole in the microphone package with the hole in the PCB. The exact degree of the alignment does not affect the
performance of the microphone as long as the holes are not partially or completely blocked.
0.522x0.725(4X)
Ø1.625
Ø1.025
1.675
0.838
0.822
1.252
Figure 11. Recommended PCB Land Pattern Layout
0.422x0.625(4X)
Ø1.625
Ø1.125
1.675
0.1(4x)
0.822
1.252
Figure 12. Recommended Solder Paste Stencil Pattern Layout
PCB MATERIAL AND THICKNESS
The performance of the ICS-40180 is not affected by PCB thickness. The ICS-40180 can be mounted on either a rigid or flexible PCB.
A flexible PCB with the microphone can be attached directly to the device housing with an adhesive layer. This mounting method
offers a reliable seal around the sound port while providing the shortest acoustic path for good sound quality.
Page 10 of 14
Document Number: DS-000021
Revision: 1.2
TDK [ TDK ELECTRONICS ]
