ICM-20602
DIMENSIONS IN MILLIMETERS
NOM
SYMBOLS
MIN
MAX
Total Thickness
Substrate Thickness
Mold Thickness
A
0.7
0.75
0.8
A1
A2
0.105 REF
0.63 REF
D
E
2.9
2.9
0.2
0.3
3
3
3.1
3.1
0.3
0.4
Body Size
Lead Width
Lead Length
W
0.25
L
0.35
0.5 BSC
Lead Pitch
Lead Count
e
n
16
2 BSC
1 BSC
---
D1
E1
SD
Edge Ball Center to Center
Body Center to Contact Ball
SE
b
---
---
---
---
---
---
---
Ball Width
Ball Diameter
Ball Opening
Ball Pitch
---
---
---
---
e1
n1
Ball Count
Pre-Solder
Package Edge Tolerance
aaa
bbb
ddd
eee
fff
0.1
0.2
0.08
---
Mold Flatness
Coplanarity
Ball Offset (Package)
Ball Offset (Ball)
---
Lead Edge to Package Edge
M
0.05
0.1
0.15
Table 16. Package Dimensions Table
Document Number: DS-000176
Revision: 1.0
Page 54 of 57
Revision Date: 10/03/2016
TDK [ TDK ELECTRONICS ]
