TCS230
PROGRAMMABLE
COLOR LIGHT-TO-FREQUENCY CONVERTER
TAOS046Q − JULY 2008
MECHANICAL INFORMATION
This SOIC package consists of an integrated circuit mounted on a lead frame and encapsulated with an electrically
nonconductive clear plastic compound. The TCS230 has an 8
×
8 array of photodiodes with a total size of 1.15 mm
by 1.15 mm. The photodiodes are 120
μm
×
120
μm
in size and are positioned on 144
μm
centers.
PACKAGE D
NOTE B
2.12
+
0.250
3.00
+
0.250
PLASTIC SMALL-OUTLINE
TOP VIEW
BOTTOM VIEW
PIN 1
PIN 1
6
y
1.27
8
y
0.510
0.330
SIDE VIEW
j
2.8 TYP
CLEAR WINDOW
END VIEW
0.50
0.25
5.00
4.80
5.3
MAX
455
0.88 TYP TOP OF
SENSOR DIE
A
1.75
1.35
4.00
3.80
6.20
5.80
DETAIL A
0.25
0.19
Pb
NOTES: A.
B.
C.
D.
1.27
0.41
0.25
0.10
All linear dimensions are in millimeters.
The center of the 1.15-mm by 1.15-mm photo-active area is referenced to the upper left corner tip of the lead frame (Pin 1).
Package is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.
This drawing is subject to change without notice.
Figure 6. Package D — Plastic Small Outline IC Packaging Configuration
Copyright
E
2008, TAOS Inc.
r
r
The
LUMENOLOGY
r
Company
8
www.taosinc.com
TAOS [ TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS ]
