TCS230
PROGRAMMABLE
COLOR LIGHT-TO-FREQUENCY CONVERTER
TAOS046Q − JULY 2008
MANUFACTURING INFORMATION
The Plastic Small Outline IC package (D) has been tested and has demonstrated an ability to be reflow soldered
to a PCB substrate.
The solder reflow profile describes the expected maximum heat exposure of components during the solder
reflow process of product on a PCB. Temperature is measured on top of component. The component should
be limited to a maximum of three passes through this solder reflow profile.
Table 2. TCS230 Solder Reflow Profile
PARAMETER
Average temperature gradient in preheating
Soak time
REFERENCE
TCS230
2.5°C/sec
t
2 to 3 minutes
Max 60 sec
soak
Time above 217°C
t
1
Time above 230°C
t
Max 50 sec
2
Time above T
−10°C
t
Max 10 sec
peak
3
Peak temperature in reflow
T
260° C (−0°C/+5°C)
Max −5°C/sec
peak
Temperature gradient in cooling
Not to scale — for reference only
T
peak
T
3
T
T
2
1
Time (sec)
t
t
t
3
2
1
t
soak
Figure 8. TCS230 Solder Reflow Profile Graph
Copyright E 2008, TAOS Inc.
The LUMENOLOGY r Company
r
r
10
www.taosinc.com
TAOS [ TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS ]
