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Setup
2.4 Operation
When the EVM is connected the host computer, the latter should automatically detect the device as an
HDC1050EVM/HDC1000EVM.
Launch the GUI. A detailed description of the GUI operation is presented later in this document.
2.5 Reducing the Sensor Thermal Mass
The HDC1050EVM can be broken into 2 sections to isolate the thermal mass of the µC from the
HDC1050. The yellow arrow in Figure 10 shows the board perforations that allow the two sections to be
broken apart.
Figure 10. HDC1050EVM µC and Sensor Sections
The communication between the two modules is achieved through the connectors J1 and J2 and a 4-wire
cable. In this configuration the thermal mass of the EVM is dramatically reduced, improving the
temperature measurement performance of the HDC1050. The cable connecting J1 to J2 must conform to
I2C cable length constraints. When used in this configuration, the GUI can still be used to communicate
with the EVM and collect data.
If the thermal mass of the sensor section is still excessive, the sensor section can be reduced by breaking
it at the perforation shown by the yellow arrow, indicated in Figure 11. The PCB segment that hosts the
HDC1050 is 5.5mm x 5mm.
Figure 11. HDC1050EVM Small Sensor Section
9
SNAU181A–June 2015–Revised June 2015
HDC1050EVM User 's Guide
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