CC2430
18.1 Recommended PCB layout for package (QLP 48)
Figure 52: Recommended PCB layout for QLP 48 package
Note: The figure is an illustration only and not to scale. There are nine 14 mil diameter via holes
distributed symmetrically in the ground pad under the package. See also the CC2430 EM reference
design
18.2 Package thermal properties
Table 52: Thermal properties of QLP 48 package
Thermal resistance
Air velocity [m/s]
Rth,j-a [K/W]
0
25.6
18.3 Soldering information
The recommendations for lead-free solder reflow in IPC/JEDEC J-STD-020C should be followed.
18.4 Tray specification
Table 53: Tray specification
Tray Specification
Package
QLP 48
Tray Width
Tray Height
Tray Length
Units per Tray
260
135.9mm ± 0.25mm
7.62mm ± 0.13mm
322.6mm ± 0.25mm
18.5 Carrier tape and reel specification
Carrier tape and reel is in accordance with EIA Specification 481.
CC2430 Data Sheet (rev. 2.1) SWRS036F
Page 207 of 211
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