欢迎访问ic37.com |
会员登录 免费注册
发布采购

CC1111F32RSPR 参数 Datasheet PDF下载

CC1111F32RSPR图片预览
型号: CC1111F32RSPR
PDF下载: 下载PDF文件 查看货源
内容描述: 低功耗低于1 GHz的射频系统级芯片(SoC )与MCU,存储器,收发器和USB控制器 [Low-power sub-1 GHz RF System-on-Chip (SoC) with MCU, memory, transceiver, and USB controller]
分类和应用: 存储射频控制器
文件页数/大小: 240 页 / 2823 K
品牌: TAOS [ TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS ]
 浏览型号CC1111F32RSPR的Datasheet PDF文件第32页浏览型号CC1111F32RSPR的Datasheet PDF文件第33页浏览型号CC1111F32RSPR的Datasheet PDF文件第34页浏览型号CC1111F32RSPR的Datasheet PDF文件第35页浏览型号CC1111F32RSPR的Datasheet PDF文件第37页浏览型号CC1111F32RSPR的Datasheet PDF文件第38页浏览型号CC1111F32RSPR的Datasheet PDF文件第39页浏览型号CC1111F32RSPR的Datasheet PDF文件第40页  
CC1110Fx / CC1111Fx  
9.2 Radio  
CC1110Fx/CC1111Fx features an RF transceiver  
based on the industry-leading CC1101, requiring  
very few external components. See Section 10  
for details.  
10 Application Circuit  
Only a few external components are required  
Figure 12. The recommended CC1111Fx circuit  
uses a fundamental crystal. The external  
components are described in Table 28, and  
typical values are given in Table 29.  
for  
using  
the  
CC1110Fx/CC1111Fx.  
The  
recommended application circuit for CC1110Fx is  
shown in Figure 10. The recommended  
application circuits for CC1111Fx are shown in  
10.1 Bias Resistor  
The bias resistor R271 is used to set an  
accurate bias current.  
10.2 Balun and RF Matching  
The balanced RF input and output of  
CC1110Fx/CC1111Fx share two common pins and  
are designed for a simple, low-cost matching  
and balun network on the printed circuit board.  
The receive- and transmit switching at the  
CC1110Fx/CC1111Fx front-end is controlled by a  
dedicated on-chip function, eliminating the  
need for an external RX/TX-switch.  
The  
passive  
matching/filtering  
network  
connected to CC1110Fx/CC1111Fx should have the  
following differential impedance as seen from  
the RF-port (RF_P and RF_N) towards the  
antenna:  
Z
Z
Z
out 315 MHz = 122 + j31  
out 433 MHz = 116 + j41 Ω  
out 868/915 MHz = 86.5 + j43 Ω  
A few passive external components combined  
with the internal RX/TX switch/termination  
circuitry ensure match in both RX and TX  
mode.  
To ensure optimal matching of the  
CC1110Fx/CC1111Fx differential output it is highly  
recommended to follow the CC1110EM  
reference designs [1] or the CC1111 USB-  
Dongle Reference Design [4] as closely as  
possible. Gerber files for the reference designs  
are available for download from the TI website.  
Although CC1110Fx/CC1111Fx has a balanced RF  
input/output, the chip can be connected to a  
single-ended antenna with few external low  
cost capacitors and inductors.  
10.3 Crystal  
what the internal RC oscillator can provide.  
When not using X2, P2_3 and P2_4 may be  
used as general IO pins.  
The crystal oscillator for the CC1110Fx uses an  
external crystal X1, with two loading capacitors  
(C201 and C211).  
The loading capacitor values depend on the  
total load capacitance, CL, specified for the  
crystal. The total load capacitance seen  
between the crystal terminals should equal CL  
for the crystal to oscillate at the specified  
frequency. For the CC1110Fx using the crystal  
X1, the load capacitance CL is given as:  
The crystal oscillator for the CC1111Fx uses an  
external crystal X1, with two loading capacitors  
(C203 and C214).  
Note: The high speed crystal oscillator  
must be stable (SLEEP.XOSC_STB=1)  
before using the radio.  
1
CL =  
+ CParasitic  
1
1
+
The recommended application circuits also  
show the connections for an optional 32.768  
kHz crystal oscillator with external crystal X2  
and loading capacitors C181 and C171. This  
crystal can be used by the Sleep Timer if more  
accurate wake-up intervals are needed than  
C211 C201  
The parasitic capacitance is constituted by pin  
input capacitance and PCB stray capacitance.  
Total parasitic capacitance is typically 2.5 pF.  
SWRS033E  
Page 36 of 239