■ PRECAUTIONS
LEM Type，LB Type，CB Type
1．Circuit Design
◆Operating environment
1．The products described in this specification are intended for use in general electronic equipment,(office supply equipment, telecommunications systems,
Precautions
measuring equipment, and household equipment). They are not intended for use in mission-critical equipment or systems requiring special quality and high
reliability (traffic systems, safety equipment, aerospace systems, nuclear control systems and medical equipment including life-support systems,) where product
failure might result in loss of life, injury or damage. For such uses, contact TAIYO YUDEN Sales Department in advance.
2．PCB Design
◆Land pattern design
Precautions
1．Please contact any of our offices for a land pattern, and refer to a recommended land pattern of a right figure or specifications.
PRECAUTIONS
【Recommended Land Patterns】
Surface Mounting
・Mounting and soldering conditions should be checked beforehand.
・Applicable soldering process to those products is reflow soldering only.
・Recommended Land Patterns
Unit : mm
TYPE
1608
A
B
C
1.0
0.9
1.45
1.8
2.0
1.5
2.0
2.7
0.55
0.55
0.7
0.7
0.8
0.9
1.0
1.0
0.7
0.8
0.8
0.8
1.2
1.5
1.6
1.6
MF1608
2012
Technical
consider-
ations
2016
2518
C
LEM2520
3218
3225
A
B
A
3．Considerations for automatic placement
◆Adjustment of mounting machine
Precautions
1. Excessive impact load should not be imposed on the products when mounting onto the PC boards.
2. Mounting and soldering conditions should be checked beforehand.
Technical
consider- 1. When installing products, care should be taken not to apply distortion stress as it may deform the products.
ations
4．Soldering
◆Wave soldering（LEM Type only）
1．For wave soldering,please apply conditions meeting the range of the specifed conditions in our catalog or the relevant specifications.
◆Reflow soldering（LB and CB Types）
1．For reflow soldering with either leaded or lead-free solder,the profile specified in "point for controlling" is recommended.
Precautions ◆Reflow soldering（LEM）
1．For reflow soldering, please apply conditions meeting the range of the specified conditions in our catalog or the relevant specifications.
◆Recommended conditions for using a soldering iron
1．Put the soldering iron on the land-pattern. Soldering iron's temperature-Below 350℃ Duration-3 secons or less. The soldering iron shoud not come in contact
with inductor directly.
◆Wave soldering（LEM Type only）
1．Components can be damaged by excessive heat where soldering conditions exceed the specified range.
◆Reflow soldering（LB and CB Types）
1．Reflow profile
300
（LB・CB Type）
Peak Temp: 260＋0/ー5℃
250
200
150
100
50
5 sec Max
Technical
consider-
ations
230℃ Minn
Pre-heat zone
180℃
150℃
30±10 sec
90±30 sec
0
◆Recommended conditions for using a soldering iron
1．Components can be damaged by excessive heat where soldering conditions exceed the specified range.
5．Cleaning
◆Cleaning conditions
1．LEM Type, LB Type, CB Type
Washing by supersonic waves shall be avoided.
Precautions
Technical ◆Cleaning conditions
consider-
ations
1．LEM Type, LB Type, CB Type
If washing by supersonic waves, supersonic waves may cause broken products.
6．Handling
◆Handling
1．Keep the inductors away from all magnets and magnetic objects.
◆Breakaway PC boards（splitting along perforations）
Precautions
1．When splitting the PC board after mounting inductors, care should be taken not to give any stresses of deflection or twisting to the board.
2．Board separation should not be done manually, but by using the appropriate devices.
◆Mechanical considerations
1．Please do not give the inductors any excessive mechanical shocks.
◆Handling
1．There is a case that a characteristic varies with magnetic influence.
◆Breakaway PC boards（splitting along perforations）
1．Planning pattern configurations and the position of products should be carefully performed to minimize stress.
◆Mechanical considerations
Technical
consider-
ations
1．There is a case to be damaged by a mechanical shock.
7．Storage conditions
◆Storage
1．To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the storage area should be controlled.
ꢀ・Recommended conditions
ꢀꢀAmbient temperature：0～40℃ꢀ／ꢀHumidity：Below 70% RH
Precautions
The ambient temperature must be kept below 30℃ Even under ideal storage conditions, solderability of products electrodes may decrease as time passes. For
this reason, LE type inductors should be used within one year from the time of delivery.
LB type：Should be used within 6 months from the time of delivery.
LE type：In case of storage over 6 months, solderability shall be checked before actual usage.
Technical ◆Storage
consider-
ations
1．Under a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes and deterioration of
taping/packaging materials may take place.
＊This catalog contains the typical specification only due to the limitation of space. When you consider purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.
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wound0103_reli-PRP8
TAIYO YUDEN [ TAIYO YUDEN (U.S.A.), INC ]
