Package Outline
16-Lead SOW (Wide Body) Package Outline (WG)
10.30x7.50mm body, 2.65mm height (max), 1.27mm pitch
16
D
θ1
E1
Note 1
(Index Area
0.25D x 0.75E1)
1
E
L2
Gauge
Plane
L
L1
θ
Seating
Plane
Top View
A
h
h
A A2
e
View B
View
B
Note 1
Seating
Plane
A1
b
A
Side View
View A-A
Note 1:
This chamfer feature is optional. If it is not present, then a Pin 1 identifier must be located in the index area indicated.The Pin 1 identifier may be either
a mold, or an embedded metal or marked feature.
Symbol
MIN
Dimension
NOM
(mm)
MAX
A
2.15
-
2.65
A1
0.10
-
0.30
A2
2.05
-
2.55
b
0.31
-
0.51
D
10.10
10.30
10.50
E
9.97
10.30
10.63
E1
7.40
7.50
7.60
e
1.27
BSC
h
0.25
-
0.75
L
0.40
-
1.27
L1
1.40
REF
L2
0.25
BSC
θ
0
O
-
8
O
θ1
5
O
-
15
O
JEDEC Registration MS-013, Variation AA, Issue E, Sep. 2005.
Drawings are not to scale.
Doc. #: DSPD-16SOWWG
B032607