VF21
Die Specifications
VF21
S
G
Backside: Drain
All dimensions in mils.
Dimensions
Die
Geometry
VF21
Length
30
1
Bonding Pads
3
Backside
Metal
Au
2
Recommended Assembly Material
Wire
4
Al
Wire Size
4
1.3
Preform
5
Au - Si Eutectic
Width
30
Thickness
9
±
1.5
Material
Al-Si
Size
6 x 5.5
Notes:
1. Maximum values
2. Standard Au back is alloyed for optimum eutectic die attach. Ag backing is optional.
3. Al-Cu-Si is used for higher operating current densities. Bond pad size represents smaller gate pad.
4. Bond wire size and material depends on AuTCB, TSB or Al USB.
5. Soft solder or organic die attach methods may be used with appropriate backmetal option.
SUPERTEX [ Supertex, Inc ]
