TDA7266D
Considering the dissipated power involved in the TDA7266D application that is in the range of 5W, as explained
in a previous section, we suggest via holes ( see fig. 4).
Using via holes a more direct thermal path is obtained from the slug to the ground layer.The number of vias is
chosen accordingly to the desired performance (in our demonstration board we use 15 vias).
In fig.4 is shown as an example the footprint to be used to create the vias.
Figure 4.
The above metioned mounting solution is enough to dissipate the power involved
In the most part of the application using the TDA7266D.
If necessary a further improvement in the Rth J-Ambient can be obtained as shown in fig.5 where the
PowerSO20 is soldered onto a via hole structure with a metal plate glued on the opposite side of the board.
Figure 5. Mounting on epoxy FR4 using via Holes for heat transfer and external metal plate
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