TDA1170S
MOUNTING INSTRUCTION
The junction to ambient thermal resistance of the
TDA 1170S can be reduced by soldering the tabs
to a suitablecopperarea of the printedcircuit board
(fig. 4) or to an external heatsink (fig. 5).
The diagram of fig. 6 shows the maximum dissipa-
ble power Ptot and the Rth j-amb as a function of the
side ”s” of two equal square copper areas having
a thickness of 35 µ (1.4 mil).
Figure 4 : Example of P.C Board Copper Are
Figure 5 : Example with External Heatsink
is Used as Heatsink
Figure 6 : Maximum Power Dissipation and
Junction-Ambient Thermal
Figure 7 : Maximum Allowable Power
Dissipation versus Ambient
Temperature
Resistance versus ”S”
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STMICROELECTRONICS [ ST ]
