STP60NF06 - STP60NF06FP
THERMAL DATA
TO-220
TO-220FP
Rthj-case
Thermal Resistance Junction-case
Thermal Resistance Junction-ambient
Max
1.36
3.57
°C/W
°C/W
°C
Rthj-amb
Max
62.5
300
T
Maximum Lead Temperature For Soldering Purpose
l
AVALANCHE CHARACTERISTICS
Symbol
Parameter
Max Value
Unit
I
Avalanche Current, Repetitive or Not-Repetitive
30
A
AR
(pulse width limited by T max)
j
E
AS
Single Pulse Avalanche Energy
360
mJ
(starting T = 25 °C, I = I , V = 30 V)
j
D
AR
DD
ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED)
OFF
Symbol
Parameter
Drain-source
Test Conditions
Min.
Typ.
Max.
Unit
V
I
D
= 250 µA, V = 0
60
V
(BR)DSS
GS
Breakdown Voltage
I
Zero Gate Voltage
V
V
V
= Max Rating
1
µA
µA
nA
DSS
DS
Drain Current (V = 0)
GS
= Max Rating, T = 125 °C
10
DS
GS
C
I
Gate-body Leakage
= ± 20V
±100
GSS
Current (V = 0)
DS
ON (1)
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
4
Unit
V
V
GS(th)
V
V
= V , I = 250µA
Gate Threshold Voltage
2
DS
GS
D
R
Static Drain-source On
Resistance
= 10V, I = 30 A
0.014
0.016
Ω
DS(on)
GS
D
DYNAMIC
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
g
fs
(1)
Forward Transconductance
V
DS
=15V , I = 30 A
20
S
D
C
C
V
DS
= 25V, f = 1 MHz, V = 0
Input Capacitance
Output Capacitance
1810
360
pF
pF
pF
iss
GS
oss
C
rss
Reverse Transfer
Capacitance
125
2/9
STMICROELECTRONICS [ ST ]
