Revision history
Table 58. Document revision history (continued)
STM32F103x8, STM32F103xB
Date
Revision
Changes
Power supply supervisor updated and VDDA added to Table 9: General
operating conditions.
Capacitance modified in Figure 12: Power supply scheme on page 33.
Table notes revised in Section 5: Electrical characteristics.
Table 16: Typical and maximum current consumptions in Stop and
Standby modes modified.
Data added to Table 16: Typical and maximum current consumptions in
Stop and Standby modes and Table 21: Typical current consumption in
Standby mode removed.
fHSE_ext modified in Table 20: High-speed external user clock
characteristics on page 48. fPLL_IN modified in Table 27: PLL
characteristics on page 53.
21-Jul-2008
8
Minimum SDA and SCL fall time value for Fast mode removed from
Table 39: I2C characteristics on page 62, note 1 modified.
th(NSS) modified in Table 41: SPI characteristics on page 64 and
Figure 27: SPI timing diagram - slave mode and CPHA = 0 on page 65.
CADC modified in Table 45: ADC characteristics on page 68 and
Figure 32: Typical connection diagram using the ADC modified.
Typical TS_temp value removed from Table 49: TS characteristics on
page 72.
LQFP48 package specifications updated (see Table 55 and Table 46),
Section 6: Package characteristics revised.
Axx option removed from Table 57: Ordering information scheme on
page 85.
Small text changes.
STM32F103x6 part numbers removed (see Table 57: Ordering
information scheme). Small text changes.
General-purpose timers (TIMx) and Advanced-control timer (TIM1) on
page 15 updated.
Notes updated in Table 5: Medium-density STM32F103xx pin
definitions on page 26.
Note 2 modified below Table 6: Voltage characteristics on page 34,
|VDDx| min and |VDDx| min removed.
22-Sep-2008
9
Measurement conditions specified in Section 5.3.5: Supply current
characteristics on page 38.
IDD in standby mode at 85 °C modified in Table 16: Typical and
maximum current consumptions in Stop and Standby modes on
page 42.
General input/output characteristics on page 57 modified.
fHCLK conditions modified in Table 30: EMS characteristics on page 55.
JA and pitch value modified for LFBGA100 package in Table 56:
Package thermal characteristics. Small text changes.
90/92
Doc ID 13587 Rev 11
STMICROELECTRONICS [ ST ]
