Package characteristics
STM32F103xC, STM32F103xD, STM32F103xE
6.2
Thermal characteristics
The maximum chip junction temperature (T max) must never exceed the values given in
J
Table 10: General operating conditions on page 42.
The maximum chip-junction temperature, T max, in degrees Celsius, may be calculated
J
using the following equation:
T max = T max + (P max x )
J
A
D
JA
Where:
●
●
●
●
T max is the maximum ambient temperature in °C,
A
is the package junction-to-ambient thermal resistance, in C/W,
JA
P max is the sum of P
max and P max (P max = P
max + P max),
INT I/O
D
INT
I/O
D
P
max is the product of I and V , expressed in Watts. This is the maximum chip
DD DD
INT
internal power.
P
max represents the maximum power dissipation on output pins where:
I/O
P
max = (V × I ) + ((V – V ) × I ),
OL OL DD OH OH
I/O
taking into account the actual V / I and V / I of the I/Os at low and high level in the
OL OL
OH OH
application.
Table 70. Package thermal characteristics
Symbol
Parameter
Value
Unit
Thermal resistance junction-ambient
LFBGA144 - 10 × 10 mm / 0.8 mm pitch
40
Thermal resistance junction-ambient
LQFP144 - 20 × 20 mm / 0.5 mm pitch
30
40
46
45
50
Thermal resistance junction-ambient
LFBGA100 - 10 × 10 mm / 0.8 mm pitch
JA
°C/W
Thermal resistance junction-ambient
LQFP100 - 14 × 14 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP64 - 10 × 10 mm / 0.5 mm pitch
Thermal resistance junction-ambient
WLCSP64
6.2.1
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org
114/123
Doc ID 14611 Rev 7
STMICROELECTRONICS [ ST ]
