STM32F103xC, STM32F103xD, STM32F103xE
Package characteristics
Figure 61. WLCSP, 64-ball 4.466 × 4.395 mm, 0.500 mm pitch, wafer-level chip-scale
package outline
e1
A1 ball corner
D
A
e
A1 ball corner
e
H
Detail A
B
C
D
E
e1
E
F
Notch
G
L
aaa
L
Wafer back side
Ball
Side view
A2
A
8
7
6
5
4
Ball side
3
H
F
Marking area
G
2
1
eee
A1
b
Seating plane (see note 2)
Detail A rotated 90 ˚
CR_ME
1. Drawing is not to scale.
2. Primary datum Z and seating plane are defined by the spherical crowns of the ball.
Table 66.
WLCSP, 64-ball 4.466 × 4.395 mm, 0.500 mm pitch, wafer-level chip-scale
package mechanical data
millimeters
inches
(1)
Max
0.635
0.255
0.380
0.350
Min
0.0211
0.0081
0.0130
0.0114
Typ
0.0230
0.0091
0.0140
0.0126
0.0197
0.1378
0.0176
0.0190
4.486
4.415
0.1750
0.1722
0.1758
0.1730
0.0098
0.0079
0.0020
0.0039
64
0.1766
0.1738
Max
0.0250
0.0100
0.0150
0.0138
Symbol
Min
A
A1
A2
b
(2)
e
e1
F
G
D
E
H
L
eee
aaa
Number of balls
4.446
4.375
0.535
0.205
0.330
0.290
Typ
0.585
0.230
0.355
0.320
0.500
3.500
0.447
0.483
4.466
4.395
0.250
0.200
0.05
0.10
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Dimension is measured at the maximum ball diameter parallel to primary datum Z.
Doc ID 14611 Rev 7
109/123
STMICROELECTRONICS [ STMICROELECTRONICS ]
