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STM32F103RCT7TR 参数 Datasheet PDF下载

STM32F103RCT7TR图片预览
型号: STM32F103RCT7TR
PDF下载: 下载PDF文件 查看货源
内容描述: 高密度高性能线的基于ARM的32位MCU,具有256至512KB闪存, USB , CAN ,11个定时器, 3的ADC ,13个通信接口 [High-density performance line ARM-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces]
分类和应用: 闪存通信
文件页数/大小: 123 页 / 1691 K
品牌: STMICROELECTRONICS [ ST ]
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STM32F103xC, STM32F103xD, STM32F103xE  
Pinouts and pin descriptions  
Alternate functions(4)  
Table 5.  
High-density STM32F103xx pin definitions (continued)  
Pins  
Main  
Pin name  
function(3)  
(after reset)  
Default  
Remap  
PB3/TRACESWO  
TIM2_CH2 /  
A7 A7 A4 55 89 133  
A6 A6 B4 56 90 134  
PB3/  
PB4  
I/O FT  
I/O FT  
JTDO  
SPI3_SCK / I2S3_CK/  
SPI3_MISO  
SPI1_SCK  
PB4 / TIM3_CH1  
SPI1_MISO  
NJTRST  
I2C1_SMBA/ SPI3_MOSI  
I2S3_SD  
TIM3_CH2 /  
SPI1_MOSI  
B6 C5 A5 57 91 135  
C6 B5 B5 58 92 136  
PB5  
PB6  
I/O  
PB5  
PB6  
I/O FT  
I2C1_SCL(8)/ TIM4_CH1(8)  
USART1_TX  
I2C1_SDA(8)  
/
D6 A5 C5 59 93 137  
PB7  
I/O FT  
PB7  
FSMC_NADV /  
USART1_RX  
TIM4_CH2(8)  
D5 D5 A6 60 94 138  
C5 B4 D5 61 95 139  
BOOT0  
PB8  
I
BOOT0  
PB8  
I2C1_SCL/  
CAN_RX  
I/O FT  
TIM4_CH3(8)/SDIO_D4  
TIM4_CH4(8)/SDIO_D5  
I2C1_SDA /  
CAN_TX  
B5 A4 B6 62 96 140  
PB9  
I/O FT  
PB9  
A5 D4  
A4 C4  
-
-
-
-
97 141  
98 142  
PE0  
PE1  
I/O FT  
PE0  
PE1  
TIM4_ETR / FSMC_NBL0  
FSMC_NBL1  
I/O FT  
E5 E5 A7 63 99 143  
F5 F5 A8 64 100 144  
VSS_3  
VDD_3  
S
S
VSS_3  
VDD_3  
1. I = input, O = output, S = supply.  
2. FT = 5 V tolerant.  
3. Function availability depends on the chosen device.  
4. If several peripherals share the same I/O pin, to avoid conflict between these alternate functions only one peripheral should  
be enabled at a time through the peripheral clock enable bit (in the corresponding RCC peripheral clock enable register).  
5. PC13, PC14 and PC15 are supplied through the power switch. Since the switch only sinks a limited amount of current (3  
mA), the use of GPIOs PC13 to PC15 in output mode is limited: the speed should not exceed 2 MHz with a maximum load  
of 30 pF and these IOs must not be used as a current source (e.g. to drive an LED).  
6. Main function after the first backup domain power-up. Later on, it depends on the contents of the Backup registers even  
after reset (because these registers are not reset by the main reset). For details on how to manage these IOs, refer to the  
Battery backup domain and BKP register description sections in the STM32F10xxx reference manual, available from the  
STMicroelectronics website: www.st.com.  
7. Unlike in the LQFP64 package, there is no PC3 in the WLCSP package. The VREF+ functionality is provided instead.  
8. This alternate function can be remapped by software to some other port pins (if available on the used package). For more  
details, refer to the Alternate function I/O and debug configuration section in the STM32F10xxx reference manual,  
available from the STMicroelectronics website: www.st.com.  
9. For the LQFP64 package, the pins number 5 and 6 are configured as OSC_IN/OSC_OUT after reset, however the  
functionality of PD0 and PD1 can be remapped by software on these pins. For the LQFP100/BGA100 and  
LQFP144/BGA144 packages, PD0 and PD1 are available by default, so there is no need for remapping. For more details,  
refer to Alternate function I/O and debug configuration section in the STM32F10xxx reference manual.  
10. For devices delivered in LQFP64 packages, the FSMC function is not available.  
Doc ID 14611 Rev 7  
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