Package characteristics
STM32F103xC, STM32F103xD, STM32F103xE
(1)(2)
Figure 65. LQFP100, 14 x 14 mm 100-pin low-profile
Figure 66. Recommended footprint
(1)
quad flat package outline
0.25 mm
0.10 inch
GAGE PLANE
k
75
51
D
L
D1
76
50
L1
D3
0.5
51
75
C
76
50
0.3
16.7 14.3
b
E3 E1
E
100
26
1.2
100
26
1
25
Pin 1
identification
1
25
ccc
C
12.3
16.7
e
A1
A2
A
ai14906b
SEATING PLANE
C
1L_ME
1. Drawing is not to scale.
2. Dimensions are in millimeters.
Table 68. LQPF100 – 14 x 14 mm 100-pin low-profile quad flat package mechanical data
millimeters
inches(1)
Symbol
Min
Typ
Max
Min
Typ
Max
A
A1
A2
b
1.60
0.15
0.063
0.05
1.35
0.002
0.0531
0.0067
0.0035
0.622
0.0059
0.0571
0.0106
0.0079
0.6378
0.5591
1.40
0.22
1.45
0.0551
0.0087
0.17
0.27
c
0.09
0.20
D
15.80
13.80
16.00
14.00
12.00
16.00
14.00
12.00
0.50
16.20
14.20
0.6299
0.5512
0.4724
0.6299
0.5512
0.4724
0.0197
0.0236
0.0394
3.5°
D1
D3
E
0.5433
15.80
13.80
16.20
14.20
0.622
0.6378
0.5591
E1
E3
e
0.5433
L
0.45
0°
0.60
0.75
7°
0.0177
0°
0.0295
7°
L1
k
1.00
3.5°
ccc
0.08
0.0031
1. Values in inches are converted from mm and rounded to 4 decimal digits.
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Doc ID 14611 Rev 7
STMICROELECTRONICS [ ST ]
