Package characteristics
STM32F103xC, STM32F103xD, STM32F103xE
Figure 60. LFBGA100 - 10 x 10 mm low profile fine pitch ball grid array package
outline
1. Drawing is not to scale.
Table 65. LFBGA100 - 10 x 10 mm low profile fine pitch ball grid array package
mechanical data
millimeters
inches(1)
Symbol
Min
Typ
Max
Min
Typ
Max
A
1.700
0.0669
A1
A2
A3
A4
b
0.270
0.0106
1.085
0.30
0.0427
0.0118
0.80
0.55
0.0315
0.0217
0.3996
0.45
9.85
0.50
10.00
7.20
10.00
7.20
0.80
1.40
0.12
0.15
0.08
0.0177
0.3878
0.0197
0.3937
0.2835
0.3937
0.2835
0.0315
0.0551
D
10.15
D1
E
9.85
10.15
0.3878
0.3996
E1
e
F
ddd
eee
fff
0.0047
0.0059
0.0031
1. Values in inches are converted from mm and rounded to 4 decimal digits.
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Doc ID 14611 Rev 7
STMICROELECTRONICS [ ST ]
