Package characteristics
STM32F405xx, STM32F407xx
Figure 83. UFBGA176+25 - ultra thin fine pitch ball grid array 10 × 10 × 0.6 mm,
package outline
C
Seating plane
A2
ddd
C
A
A1
A1 ball
A
A1 ball
E
identifier index area
e
F
A
F
D
e
B
R
15
1
TOP VIEW
BOTTOM VIEW
Øb (176 + 25 balls)
Ø eee M
Ø fff
C
C
A B
M
A0E7_ME_V4
1. Drawing is not to scale.
Table 94. UFBGA176+25 - ultra thin fine pitch ball grid array 10 × 10 × 0.6 mm
mechanical data
millimeters
Typ
inches(1)
Symbol
Min
Max
Min
Typ
Max
A
0.460
0.050
0.530
0.080
0.600
0.110
0.0181
0.002
0.0209
0.0031
0.0236
0.0043
A1
A2
0.400
0.450
0.500
0.0157
0.0177
0.0197
b
D
0.230
9.900
9.900
0.280
10.000
10.000
0.650
0.330
10.100
10.100
0.0091
0.3898
0.3898
0.0110
0.3937
0.3937
0.0256
0.0177
0.0130
0.3976
0.3976
E
e
F
0.425
0.450
0.475
0.080
0.150
0.080
0.0167
0.0187
0.0031
0.0059
0.0031
ddd
eee
fff
1. Values in inches are converted from mm and rounded to 4 decimal digits.
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DocID022152 Rev 4
STMICROELECTRONICS [ ST ]
