STM32F405xx, STM32F407xx
Package characteristics
Figure 76. WLCSP90 - 0.400 mm pitch wafer level chip size package outline
e1
A1 ball location
D
e
e
Detail A
E
e2
G
A2
A
F
Bump side
Wafer back side
Side view
Detail A
rotated by 90 °C
A1
eee
b
Seating plane
A0JW_ME
Table 90. WLCSP90 - 0.400 mm pitch wafer level chip size package mechanical data
millimeters
Typ
inches(1)
Symbol
Min
Max
Min
Typ
Max
A
A1
A2
b
0.520
0.165
0.350
0.240
4.178
3.964
0.570
0.190
0.380
0.270
4.218
3.969
0.400
3.600
3.200
0.312
0.385
0.620
0.215
0.410
0.300
4.258
4.004
0.0205
0.0065
0.0138
0.0094
0.1645
0.1561
0.0224
0.0075
0.015
0.0244
0.0085
0.0161
0.0118
0.1676
0.1576
0.0106
0.1661
0.1563
0.0157
0.1417
0.126
D
E
e
e1
e2
F
0.0123
0.0152
G
eee
0.050
0.0020
1. Values in inches are converted from mm and rounded to 4 decimal digits.
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