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STM32F302RC 参数 Datasheet PDF下载

STM32F302RC图片预览
型号: STM32F302RC
PDF下载: 下载PDF文件 查看货源
内容描述: ARM的Cortex- M4F 32B MCUFPU ,高达256 KB的SRAM Flash48KB [ARM Cortex-M4F 32b MCUFPU, up to 256KB Flash48KB SRAM]
分类和应用: 静态存储器
文件页数/大小: 133 页 / 2061 K
品牌: STMICROELECTRONICS [ ST ]
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STM32F302xx/STM32F303xx  
Table 81. Document revision history  
Revision history  
Date  
Revision  
Changes  
Updated first page  
Removed references to VDDSDx and VSSSD  
Added reference to PM0214 in Section 1  
Moved Temp. sensor calibartion values toTable 74 and VREF  
calibration values to Table 27  
Updated Table 2: STM32F30xB/C family device features and  
peripheral counts on page 10  
UpdatedSection 3.4: Embedded SRAM on page 14  
Updated Section 3.2: Memory protection unit (MPU) on page 13  
Updated Section 3.23: Universal serial bus (USB) on page 28  
Modified Section 3.25: Touch sensing controller (TSC) on page 29  
Updated heading of Table 6: USART features on page 27  
Updated Table 11: STM32F302xx/STM32F303xx pin definitions on  
page 36  
Added notes to PC13, PC14 and PC15 in Table 11:  
STM32F302xx/STM32F303xx pin definitions on page 36  
Updated Figure 11: Power supply scheme on page 54  
Modified Table 19: Voltage characteristics on page 56  
Modified Table 20: Current characteristics on page 57  
Modified Table 22: General operating conditions on page 58  
Modified Figure 13: Typical VBAT current consumption (LSE and RTC  
ON/LSEDRV[1:0] = ’00’) on page 66  
Updated Section 6.3.14: I/O port characteristics on page 87  
Updated Table 28: Typical and maximum current consumption from  
VDD supply at VDD = 3.6V on page 62 and Table 29: Typical and  
maximum current consumption from the VDDA supply on page 63  
Updated Table 30: Typical and maximum VDD consumption in Stop  
and Standby modes on page 65 and Table 31: Typical and maximum  
VDDA consumption in Stop and Standby modes on page 65  
Updated Table 32: Typical and maximum current consumption from  
VBAT supply on page 66  
05-Dec-2012  
4
Added Figure 13: Typical VBAT current consumption (LSE and RTC  
ON/LSEDRV[1:0] = ’00’)  
Updated Table 33: Typical current consumption in Run mode, code  
with data processing running from Flash on page 67 and Table 34:  
Typical current consumption in Sleep mode, code running from Flash  
or RAM on page 68  
Added Table 36: Peripheral current consumption on page 71  
Added Table 35: Switching output I/O current consumption on page 70  
Updated Section 6.3.6: Wakeup time from low-power mode on page 73  
Modified ESD absolute maximum ratings on page 84  
Modified Table 53: Output voltage characteristics on page 90  
Updated EMI characteristics on page 84  
Updated Table 54: I/O AC characteristics on page 91  
Updated Table 51: I/O current injection susceptibility on page 86  
Updated Table 56: TIMx characteristics on page 93  
Updated Section 7.2: Thermal characteristics on page 126  
Added Table 67: Maximum ADC RAIN on page 106  
Added Table 68: ADC accuracy - limited test conditions on page 107  
Updated Table 69: ADC accuracy on page 109  
Updated Table 70: DAC characteristics on page 112  
Updated Table 72: Operational amplifier characteristics on page 116  
Updated figures and tables in Section 7: Package characteristics  
Doc ID 023353 Rev 5  
131/133  
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