Package characteristics
STM32F302xx/STM32F303xx
7.2
Thermal characteristics
The maximum chip junction temperature (T max) must never exceed the values given in
J
Table 22: General operating conditions on page 58.
The maximum chip-junction temperature, T max, in degrees Celsius, may be calculated
J
using the following equation:
T max = T max + (P max x Θ )
J
A
D
JA
Where:
●
●
●
●
T max is the maximum ambient temperature in °C,
A
Θ
is the package junction-to-ambient thermal resistance, in °C/W,
JA
P max is the sum of P
max and P max (P max = P
max + P max),
INT I/O
D
INT
I/O
D
P
max is the product of I and V , expressed in Watts. This is the maximum chip
DD DD
INT
internal power.
P
max represents the maximum power dissipation on output pins where:
I/O
P
max = Σ (V × I ) + Σ((V – V ) × I ),
OL OL DD OH OH
I/O
taking into account the actual V / I and V / I of the I/Os at low and high level in the
OL OL
OH OH
application.
Table 79. Package thermal characteristics
Symbol
Parameter
Value
Unit
Thermal resistance junction-ambient
LQFP64 - 10 × 10 mm / 0.5 mm pitch
45
Thermal resistance junction-ambient
LQFP48 - 7 × 7 mm
ΘJA
55
41
°C/W
Thermal resistance junction-ambient
LQFP100 - 14 × 14 mm / 0.5 mm pitch
7.2.1
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org
126/133
Doc ID 023353 Rev 5
STMICROELECTRONICS [ ST ]
