Package characteristics
STM32F105xx, STM32F107xx
Figure 39. LFBGA100 - 10 x 10 mm low profile fine pitch ball grid array package
outline
Table 58. LFBGA100 - 10 x 10 mm low profile fine pitch ball grid array package
mechanical data
mm
inches(1)
Dim.
Min
Typ
Max
Min
Typ
Max
A
1.700
0.0026
A1
A2
A3
A4
b
0.270
0.0004
1.085
0.30
0.0017
0.0005
0.80
0.55
0.0012
0.0009
0.0157
0.45
9.85
0.50
10.00
7.20
10.00
7.20
0.80
1.40
0.12
0.15
0.08
0.0007
0.0153
0.0008
0.0155
0.0111
0.0155
0.0111
0.0012
0.0022
0.0002
0.0002
0.0001
D
10.15
D1
E
9.85
10.15
0.0153
0.0157
E1
e
F
ddd
eee
fff
N (number of balls)
100
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Doc ID 15274 Rev 6
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