STM32F103x4, STM32F103x6
Package characteristics
Figure 38. VFQFPN36 6 x 6 mm, 0.5 mm pitch,
Figure 39. Recommended footprint
(1)
(1)(2)
package outline
(dimensions in mm)
Seating plane
C
ddd
C
1.00
4.30
A2
A
27
19
A1
A3
28
E2
18
b
0.50
4.10
27
19
18
4.30
28
4.10
4.80
4.80
e
D2
D
36
10
0.75
9
1
0.30
36
10
6.30
ai14870b
1
9
Pin # 1 ID
R = 0.20
L
E
ZR_ME
1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead solder joint life.
Table 51. VFQFPN36 6 x 6 mm, 0.5 mm pitch, package mechanical data
millimeters
inches(1)
Symbol
Min
Typ
Max
Min
Typ
Max
A
0.800
0.900
0.020
0.650
0.250
0.230
6.000
3.700
6.000
3.700
0.500
0.550
0.080
1.000
0.050
1.000
0.0315
0.0354
0.0008
0.0256
0.0098
0.0091
0.2362
0.1457
0.2362
0.1457
0.0197
0.0217
0.0031
0.0394
0.0020
0.0394
A1
A2
A3
b
0.180
5.875
1.750
5.875
1.750
0.450
0.350
0.300
6.125
4.250
6.125
4.250
0.550
0.750
0.0071
0.2313
0.0689
0.2313
0.0689
0.0177
0.0138
0.0118
0.2411
0.1673
0.2411
0.1673
0.0217
0.0295
D
D2
E
E2
e
L
ddd
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Doc ID 15060 Rev 5
75/87
STMICROELECTRONICS [ ST ]
