Package and packing information
STA8088EXG
3
Package and packing information
®
3.1
ECOPACK packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
3.2
TFBGA169 9 x 9 x 1.2 mm package information
Table 11.
TFBGA169 9 x 9 x 1.2 mm mechanical data
Data book (mm)
Drawing (mm)
Typ.
Ref. dim
Min.
Typ.
Max.
Min.
Max.
A(1)
A1(2)
A2
1.20
1.07
0.32
0.24
0.60
0.40
9.10
0.21
0.22
0.16
0.57
0.30
8.90
0.27
0.20
0.585
0.35
9.00
7.80
9.00
7.80
0.65
0.60
0.20
0.585
0.35
9.00
7.80
9.00
7.80
0.65
0.60
A4
b(3)
0.30
8.85
0.40
9.15
D
D1
E
9.85
9.15
8.90
9.10
E1
e
Z
ddd
eee(4)
fff(5)
0.08
0.15
0.05
0.08
0.15
0.05
1. TFBGA stands for Thin profile Fine Pitch Ball Grid Array.
- The total profile height (Dim A) is measured from the seating plane to the top of the component
- The maximum total package height is calculated by the following methodology:
2
2
2
A Max = A1 Typ + A2 Typ + A4 Typ + √(A1 + A2 + A4 tolerance values)
- Thin profile: 1.00 mm < A ≤ 1.20 mm / Fine pitch: e < 1.00 mm pitch.
2. - The terminal A1 corner must be identified on the top surface by using a corner chamfer, ink or metallized
markings, or other feature of package body or integral heatslug.
- A distinguishing feature is allowable on the bottom surface of the package to identify the terminal A1
corner. Exact shape of each corner is optional.
3. The typical ball diameter before mounting is 0.35 mm.
4. The tolerance of position that controls the location of the pattern of balls with respect to datums A and B.
For each ball there is a cylindrical tolerance zone eee perpendicular to datum C and located on true
position with respect to datums A and B as defined by e. The axis perpendicular to datum C of each ball
must lie within this tolerance zone.
18/24
Doc ID 022725 Rev. 2
STMICROELECTRONICS [ ST ]
