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M25P40-VMN6TP/X 参数 Datasheet PDF下载

M25P40-VMN6TP/X图片预览
型号: M25P40-VMN6TP/X
PDF下载: 下载PDF文件 查看货源
内容描述: 4兆位,低电压,串行闪存,具有50 MHz SPI总线接口 [4 Mbit, low voltage, serial Flash memory with 50 MHz SPI bus interface]
分类和应用: 闪存
文件页数/大小: 53 页 / 499 K
品牌: STMICROELECTRONICS [ ST ]
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Revision history  
M25P40  
13  
Revision history  
Table 25. Document revision history  
Date  
Revision  
Changes  
12-Apr-2001  
25-May-2001  
1.0  
1.1  
Document written.  
Serial Paged Flash Memory renamed as Serial Flash Memory.  
Changes to text: Signal Description/Chip Select; Hold Condition/1st para;  
Protection modes; Release from Power-down and Read Electronic  
Signature (RES); Power-up.  
Repositioning of several tables and illustrations without changing their  
contents.  
11-Sep-2001  
1.2  
Power-up timing illustration; SO8W package removed.  
Changes to tables: Abs Max Ratings/VIO; DC Characteristics/VIL.  
FAST_READ instruction added. Document revised with new timings, VWI  
,
ICC3 and clock slew rate. Descriptions of Polling, Hold Condition, Page  
Programming, Release for Deep Power-down made more precise. Value  
of tW(max) modified.  
16-Jan-2002  
12-Sep-2002  
1.3  
1.4  
Clarification of descriptions of entering Standby Power mode from Deep  
Power-down mode, and of terminating an instruction sequence or data-  
out sequence.  
VFQFPN8 package (MLP8) added. Document promoted to Preliminary  
Data.  
Typical Page Program time improved. Deep Power-down current  
changed. Write Protect setup and hold times specified, for applications  
that switch Write Protect to exit the Hardware Protection mode  
immediately before a WRSR, and to enter the Hardware Protection mode  
again immediately after.  
13-Dec-2002  
12-Jun-2003  
24-Nov-2003  
1.5  
1.6  
2.0  
Document promoted from Preliminary Data to full Datasheet.  
Table of contents, warning about exposed paddle on MLP8, and Pb-free  
options added.  
40 MHz AC Characteristics table included as well as 25 MHz. ICC3(max),  
tSE(typ) and tBE(typ) values improved. Change of naming for VDFPN8  
package.  
Automotive range added. Soldering temperature information clarified for  
RoHS compliant devices.  
12-Mar-2004  
05-Aug-2004  
3.0  
4.0  
Device grade information clarified. Data-retention measurement  
temperature corrected. Details of how to find the date of marking added.  
Small text changes. Notes 2 and 3 removed from Table 24: Ordering  
information scheme.  
03-Jan-2005  
01-Aug-2005  
5.0  
6.0  
End timing line of tSHQZ modified in Figure 25: Output timing.  
Updated Page Program (PP) instructions in Page Programming, Page  
Program (PP), Instruction times (device grade 6) and Instruction times  
(device grade 3).  
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