M25P32
MAXIMUM RATING
Stressing the device outside the ratings listed in
Table 9. may cause permanent damage to the de-
vice. These are stress ratings only, and operation
of the device at these, or any other conditions out-
side those indicated in the Operating sections of
this specification, is not implied. Exposure to Ab-
solute Maximum Rating conditions for extended
periods may affect device reliability. Refer also to
the STMicroelectronics SURE Program and other
relevant quality documents.
Table 9. Absolute Maximum Ratings
Symbol
Parameter
Min.
Max.
Unit
°C
°C
V
T
Storage Temperature
–65
150
STG
1
TLEAD
VIO
Lead Temperature during Soldering
Input and Output Voltage (with respect to Ground)
Supply Voltage
See note
–0.6
–0.6
4.0
4.0
V
V
CC
2
VESD
–2000
2000
V
Electrostatic Discharge Voltage (Human Body model)
®
Note: 1. Compliant with JEDEC Std J-STD-020B (for small body, Sn-Pb or Pb assembly), the ST ECOPACK 7191395 specification, and
the European directive on Restrictions on Hazardous Substances (RoHS) 2002/95/EU
2. JEDEC Std JESD22-A114A (C1=100 pF, R1=1500 Ω, R2=500 Ω)
29/39
STMICROELECTRONICS [ ST ]
