M24C16-125 M24C08-125 M24C04-125 M24C02-125
Package mechanical data
Figure 13. TSSOP8 – 8 lead thin shrink small outline, package outline
D
8
5
c
E1
E
1
4
α
A1
L
A
A2
L1
CP
b
e
TSSOP8AM
1. Drawing is not to scale.
2. The circle in the top view of the package indicates the position of pin 1.
Table 12. TSSOP8 – 8 lead thin shrink small outline, package mechanical data
millimeters
Min.
inches(1)
Symbol
Typ.
Max.
Typ.
Min.
Max.
A
A1
A2
b
-
-
1.200
0.150
1.050
0.300
0.200
0.100
3.100
-
-
-
0.0472
0.0059
0.0413
0.0118
0.0079
0.0039
0.1220
-
-
0.050
0.800
0.190
0.090
-
-
0.0020
0.0315
0.0075
0.0035
-
1.000
-
0.0394
-
c
-
-
CP
D
-
-
3.000
0.650
6.400
4.400
0.600
1.000
-
2.900
-
0.1181
0.0256
0.2520
0.1732
0.0236
0.0394
-
0.1142
-
e
E
6.200
4.300
0.450
-
6.600
4.500
0.750
-
0.2441
0.1693
0.0177
-
0.2598
0.1772
0.0295
-
E1
L
L1
α
0°
8°
0°
8°
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Doc ID 022564 Rev 1
27/30
STMICROELECTRONICS [ ST ]
