Package information
DALC208
6
Package information
●
Epoxy meets UL94, V0
In order to meet environmental requirements, ST offers these devices in ECOPACK
®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at
Table 5.
SOT23-6L dimensions
Dimensions
Ref.
A
E
Millimeters
Min. Typ. Max.
Min.
Inches
Typ.
Max.
0.057
0.004
0.051
0.020
0.008
0.118
0.069
0.037
A
e
b
e
D
0.90
0
0.90
0.35
0.09
2.80
1.50
0.95
2.60
0.10
0°
1.45 0.035
0.10
0
A1
A2
b
c
A2
1.30 0.035
0.50 0.014
0.20 0.004
3.05
0.11
D
E
e
1.75 0.059
c
A1
θ
L
H
H
L
θ
3.00 0.102
0.60 0.004
10°
0°
0.118
0.024
10°
Figure 27. Footprint (dimensions in mm)
0.60
1.20
0.95
3.50
2.30
1.10
12/14
STMICROELECTRONICS [ STMICROELECTRONICS ]
