FLGA
Fine Pitch Land Grid Array
• Array molded, cost effective, space-saving
packaging solution
• Available in 1.20mm (TFLGA), 1.00mm
(VFLGA), and 0.80mm (WFLGA) maximum
thickness
• Thinner than FBGA
• Exposed thermal/mechanical lands available
• Laminate substrate based enabling 2 and 4
layers of routing flexibility
FEATURES
• Low profile
• Flexible body sizes range from 4 x 4mm to
13 x 13mm
• Flip chip and discrete passive options (SiP)
• Minimum 0.50mm pitch (array and peripheral land
pads)
• Flexible land pattern arrangement
• Pb-free and halogen-free compatible materials
available
• JEDEC standard compliant
DESCRIPTION
STATS ChipPAC’s FLGA is a laminate substrate based package
with plastic overmolded encapsulation. Unlike a standard
FBGA, second level interconnect is achieved on the LGA by
connecting “lands” on the package directly onto the PCB
through solder re-flow. The elimination of solder balls brings
better electrical performance and lower package profile
without using the more expensive thinner BT core material.
It also offers the flexibility of land pattern arrangement in
the form of signal lands or heat spreader/ground pads to
suit the thermal and electrical requirements of various
devices. The FLGA package’s reduced outline and thickness
make it an ideal advanced technology packaging solution
for high performance and/or portable applications. STATS
ChipPAC’s FLGA is available in a broad range of JEDEC
standard body sizes including TFLGA (<1.20mm), VFLGA
(<1.00mm) and WFLGA (<0.80mm) package thickness.
APPLICATIONS
• Handheld devices
• Wireless RF
• Analog
• ASIC
• Memory
• Simple PLDs
www.statschippac.com
STATSCHIP [ STATS CHIPPAC, LTD. ]
