□□1111R
Surface Mount IRED/Reverse Mount Type
Reflow Soldering Conditions
1) The above profile temperature gives the maximum temperature of the LED resin surface.
Please set the temperature so as to avoid exceeding this range.
2) Total times of reflow soldering process shall be no more than 2 times.
When the second reflow soldering process is performed, intervals between the first
and second reflow should be short as possible (while allowing some time for the
component to return to normal temperature after the first reflow) in order to prevent the
LED from absorbing moisture.
3) Temperature fluctuation to the LED during the pre-heating process shall be minimized.
Manual Soldering Conditions
Iron tip temp.
Soldering time and frequency
(MAX.) (30 W Max.)
350 ℃
3 s
1 time
(MAX.)
(MAX.)
Page 12
2010.03.30
STANLEY [ STANLEY ELECTRIC CO.,LTD. ]
