FlashFlex MCU
SST89E516RD2 / SST89E516RD
SST89V516RD2 / SST89V516RD
Data Sheet
16.0 PACKAGING DIAGRAMS
TOP VIEW
SIDE VIEW
BOTTOM VIEW
See notes
2 and 3
0.2
Pin #1
Pin #1
0.5 BSC
6.00 0.10
4.1
4.1
0.076
0.30
0.18
0.45
0.35
0.05 Max
6.00 0.10
0.80
0.70
Note: 1. Complies with JEDEC JEP95 MO-220I, variant WJJD-5 except external paddle nominal dimensions.
2. From the bottom view, the pin #1 indicator may be either a 45-degree chamfer or a half-circle notch.
1mm
40-wqfn-6x6-QI-0.0
3. The external paddle is electrically connected to the die back-side and possibly to certain V leads.
SS
This paddle can be soldered to the PC board; it is suggested to connect this paddle to the V of the unit.
SS
Connection of this paddle to any other voltage potential can result in shorts and/or electrical malfunction of the device.
4. Untoleranced dimensions (shown with box surround) are nominal target dimensions.
5. All linear dimensions are in millimeters (max/min).
FIGURE 16-1: 40-contact Very-very-thin Quad Flat No-lead (WQFN)
SST Package Code: QI
40
C
L
.600
.625
1
Pin #1 Identifier
.530
.557
2.020
2.070
.065
.075
12˚
4 places
.220 Max.
Base Plane
Seating Plane
.015 Min.
0˚
15˚
.008
.012
.100 †
.200
.063
.090
.045
.055
.015
.022
.100 BSC
.600 BSC
Note:
1. Complies with JEDEC publication 95 MS-011 AC dimensions (except as noted), although some dimensions may be more stringent.
† = JEDEC min is .115; SST min is less stringent
2. All linear dimensions are in inches (min/max).
40-pdip-PI-7
3. Dimensions do not include mold flash. Maximum allowable mold flash is .010 inches.
FIGURE 16-2: 40-pin Plastic Dual In-line Pins (PDIP)
SST Package Code: PI
©2007 Silicon Storage Technology, Inc.
S71273-03-000
1/07
79
SST [ SILICON STORAGE TECHNOLOGY, INC ]
