16 Mbit Concurrent SuperFlash + 2 / 4 Mbit SRAM ComboMemory
SST34HF1621 / SST34HF1641
Data Sheet
PACKAGING DIAGRAMS
BOTTOM VIEW
10.00 0.20
5.60
TOP VIEW
0.80
8
7
6
5
4
3
2
1
8
7
6
5
4
3
2
1
5.60
8.00 0.20
0.80
0.40 0.05
(56X)
H
G F E D C B A
A
B C D E F G H
A1 CORNER
A1 CORNER
1.30 0.10
SIDE VIEW
0.15
SEATING PLANE
56ba-lfbga-LFP-8x10-400mic-ILL.6
1mm
0.32 0.05
Note: 1. Although many dimensions are similar to those of JEDEC Publication 95, MO-210,
this specific package is not registered.
2. All linear dimensions are in millimeters.
3. Coplanarity: 0.1 ( .05) mm.
4. The actual shape of the corners may be slightly different than as portrayed in the drawing.
56-BALL LOW-PROFILE, FINE-PITCH BALL GRID ARRAY (LFBGA) 8MM X 10MM (64 POSSIBLE BALL POSITIONS)
SST PACKAGE CODE: LFP
Note: This package will be replaced by L1P which increases the ball size from 400-micron to 450-micron.
Check with factory for migration schedule.
©2001 Silicon Storage Technology, Inc.
S71172-05-000 10/01 523
30
SST [ SILICON STORAGE TECHNOLOGY, INC ]
