2 Megabit Multi-Purpose Flash
SST39SF020
Preliminary Specifications
PACKAGING DIAGRAMS
pin 1 index
1
1
2
C
L
Optional Ejector Pin
Indentation Shown for
Conventional Mold Only
3
.600
.625
32
.530
.550
1.645
1.655
.065
.075
7˚
4
4 PLCS.
.170
.200
Base Plane
Seating Plane
5
.015
.050
0˚
15˚
.008
.012
.120
.150
6
.070
.080
.045
.065
.016
.022
.100 BSC
.600 BSC
Note:
1. Complies with JEDEC publication 95 MO-015 AP dimensions, although some dimensions may be more stringent.
2. All linear dimensions are in inches (min/max).
3. Dimensions do not include mold flash. Maximum allowable mold flash is .010 inches.
7
32.pdipPH-ILL.0
8
32-LEAD PLASTIC DUAL-IN-LINE PACKAGE (PDIP)
SST PACKAGE CODE: PH
9
TOP VIEW
SIDE VIEW
BOTTOM VIEW
10
11
12
13
14
15
16
.485
.495
.447
.453
1
.106
.112
.045 Dia. x .000/.010
Deep Polished
(Optional) .042
.048
.023
.029
.030
.040
.020 R.
MAX.
x 30˚
R.
2
32
.076/.125 Dia.
Ejector Pin
.042
.048
.013
.021
.400 .490
BSC .530
.585
.595
.547
.553
.026
.032
1
.020 High x .002
Deep Characters
.050
BSC.
.015 Min.
.075
.095
.050
BSC.
.026
.032
.125
.140
Note:
1. Complies with JEDEC publication 95 MS-016 AE dimensions, although some dimensions may be more stringent.
2. All linear dimensions are in inches (min/max).
3. Dimensions do not include mold flash. Maximum allowable mold flash is .008 inches.
32.PLCC.NH-ILL.0
32-LEAD PLASTIC LEAD CHIP CARRIER (PLCC)
SST PACKAGE CODE: NH
© 1998 Silicon Storage Technology, Inc.
326-10 12/98
21
SST [ SILICON STORAGE TECHNOLOGY, INC ]
