S P S E M I
ꢀ ꢁ ꢂ ꢃ
TECC(1000W) Series
Recommended Soldering Conditions
Recommended Conditions
Reflow Soldering
Pb-Free assembly
Re”ow Condition
(see Fig.1)
tP
TP
-Temperature Min(T s(min))
+150℃
Ramp-up
Critical Zone
TL to TP
-Temperature Max(T s(max))
-Time(Min to Max)(t s)
Pre Heat
+200℃
TL
60-180secs
3℃/sec.Max.
tL
Average ramp up rate
(Liquidus Temp(TL) to peak)
Ts(max)
Ramp-down
Ts(max) to TL -Ramp-up Rate
3℃/sec.Max.
+217℃
Preheat
-Temperature(TL)(Liquidus)
-Temperature(tL)
Ts(min)
25
Re”ow
ts
60-150secs
+260(+0/-5)℃
30 secs.Max.
6℃/sec.Max.
8 min.Max.
+260℃
Peak Temp(TP)
Time within 5℃ of actual Peak Temp(tP)
time to peak temperature
(t 25℃ to peak)
Time
Ramp-down Rate
Time 25℃ to Peak Temp(TP)
Do not exceed
Marking Code
Cathode Band
****
6 H
****
6 D
Logo
Logo
Date Code
Date Code
Marking Code
Marking Code
Tape And Reel Specification
REEL DIA
(mm)
Symbol
Industry Standard
Ea Per Reel
3000
EIA RS-481
TECC***
330
0.157
(4.0)
0.47
(12.0)
0.314
(8.0)
13.0(330)
0.49
(12.0)
Page 4 of 4
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