SL23EP08
Package Outline and Package Dimensions
16-Lead TSSOP (4.4mm)
9
16
6.250(0.246)
6.500(0.256)
4.300(0.169)
4.500(0.177)
Dimensions are in milimeters(inches).
Top line: (MIN) and Bottom line: (Max)
Pin-1 ID
1
8
2.900(0.114)
3.100(0.122)
1.100(0.043) MAX
0.650(0.025)
BSC
0.090(0.003)
0.200(0.008)
0.050(0.002)
0.150(0.006)
0.850(0.033)
0.950(0.037)
Gauge
Plane
0.076(0.003)
Seating Plane
0.500(0.020)
0.700(0.027)
0.190(0.007)
0.300(0.012)
0 to 8°
0.650(0.025)
BSC
Thermal Characteristics
Parameter
Symbol
Condition
Min
Typ
80
Max
Unit
°C/W
°C/W
°C/W
ș JA
ș JA
ș JA
Still air
-
-
-
-
-
-
Thermal Resistance
Junction to Ambient
1m/s air flow
3m/s air flow
70
68
Thermal Resistance
Junction to Case
ș JC
Independent of air flow
-
36
-
°C/W
Rev 1.4, May 28, 2007
Page 16 of 18