P r e l i m i n a r y
Connection Diagrams
For S29GL064M (model R0) only.
63-Ball Fine-Pitch BGA
Top View, Balls Facing Down
L8
M8
A8
B8
NC*
NC*
NC*
NC*
C7
D7
E7
F7
G7
H7
J7
K7
L7
M7
A7
B7
A14
A13
A15
A16
A17
NC
A20
V
SS
NC*
NC*
NC*
NC*
C6
D6
A8
E6
F6
G6
H6
J6
K6
A9
A11
A12
A19
A10
DQ6
DQ7
C5
D5
E5
F5
G5
H5
J5
K5
WE# RESET# A22
NC
DQ5
NC
V
DQ4
CC
C4
D4
E4
F4
G4
H4
J4
K4
RY/BY# ACC
NC
NC
DQ2
DQ3
V
A21
IO
C3
A7
D3
E3
A6
F3
A5
G3
H3
J3
K3
A18
DQ0
NC
NC
DQ1
A2
L2
M2
C2
A3
D2
A4
E2
A2
F2
A1
G2
A0
H2
J2
K2
NC*
CE#
OE#
V
NC*
NC*
SS
A1
B1
L1
M1
* Balls are shorted together via the substrate but not connected to the die.
NC*
NC*
NC*
NC*
Special Package Handling Instructions
Special handling is required for Flash Memory products in molded packages (TSOP and BGA). The
package and/or data integrity may be compromised if the package body is exposed to temperatures
above 150°C for prolonged periods of time.
14
S29GLxxxM MirrorBitTM Flash Family
S29GLxxxM_00A5 April 30, 2004
SPANSION [ SPANSION ]
