P r e l i m i n a r y
Connection Diagrams
63-Ball Fine-Pitch BGA
Top View, Balls Facing Down
L8
M8
A8
B8
NC*
NC*
NC*
NC*
A7
B7
C7
D7
E7
F7
G7
H7
J7
K7
L7
M7
BYTE#1 DQ15/A
-1
VSS
NC*
NC*
NC*
NC*
A13
A12
A14
A15
A16
C6
A9
D6
A8
E6
F6
G6
H6
J6
K6
A10
A11
DQ7
DQ14
DQ13
DQ6
C5
D5
E5
F5
G5
H5
J5
K5
VCC
WE# RESET#
A21
A19
DQ5
DQ12
DQ4
C4 D4
E4
F4
G4
H4
J4
K4
RY/BY# WP#/ACC A18
A20
DQ2
DQ10
DQ11
DQ3
C3
A7
D3
E3
A6
F3
A5
G3
H3
J3
K3
A17
DQ0
DQ8
DQ9
DQ1
C2
A3
D2
A4
E2
A2
F2
A1
G2
A0
H2
J2
K2
L2
M2
A2
VSS
CE#
OE#
NC*
NC*
NC*
A1
B1
L1
M1
* Balls are shorted together via the substrate but not connected to the die.
NC*
NC*
NC*
NC*
Notes:
1. Ball H7 is VIO on S29GL064M (model R5).
Special Package Handling Instructions
Special handling is required for Flash Memory products in molded packages (TSOP and BGA). The
package and/or data integrity may be compromised if the package body is exposed to temperatures
above 150°C for prolonged periods of time.
April 30, 2004 S29GLxxxM_00A5
S29GLxxxM MirrorBitTM Flash Family
13
SPANSION [ SPANSION ]
